photocadCALC

photocadCALC

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In the production of electronics, SMT stencils are needed to press soldering paste onto circuit boards. The amount of soldering paste depends on the thickness of the SMT stencil and the opening in the stencil.

In order for the soldering paste to stick to the circuit board, the area ratio and the aspect ratio of the stencil needs to be taken into consideration. With the photocadCALC program, you can easily and quickly calculate the maximum possible thickness for laser-cut SMT stencils for different stencil openings.

When you enter the values for the stencil opening, you are given the maximum stencil thickness for standard SMT stencils and for nano-finished SMT stencils.
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